Advanced Chip Materials and Process Integration Comprehensive Testing Platform
Definition: The advanced chip materials and process integration testing platform is a high-end instrument and equipment base serving the "Made in China" strategy.
Objective: To provide comprehensive technical services for advanced chip materials research, characterization, preparation, testing, product processing, incubation, and commercialization for cutting-edge research in advanced chip material development and electronic manufacturing.
Platform Services:
1）Morphology characterization and composition analysis, covering macroscopic and microscopic morphology detection and composition analysis.
2）Structure and property analysis, including mass spectrometry, chromatography, spectroscopy analysis, thermal analysis, electrochemical analysis, surface analysis, and performance analysis.
3）Mechanical performance testing, including dynamic/static mechanical property testing, especially non-linear testing.
4）Precision manufacturing and processing.
Chip Manufacturing and Packaging Material Database Services
Definition: A material database unified with chip manufacturing-packaging processes and reliability models, providing various material data.
Objective: The chip manufacturing-packaging material database provides material constitutive data that can be directly used for multi-physics, multi-scale simulations.
Platform Services: Providing basic (constitutive) data services for thermal analysis, force analysis, electromagnetic analysis, and multi-scale and multi-physics coupling simulations required for advanced chip manufacturing-packaging process analysis.
Collaborative Simulation Design Service for Chip Manufacturing with Multi-field and Multi-scale Coupling
Definition: The service provides chip manufacturing-packaging simulation based on first-principles molecular dynamics, interface fracture mechanics, and damage mechanics, incorporating nonlinear global-local, thermo-hydro-mechanical-electromagnetic-optical multi-field coupling.
Objective: With the continuous miniaturization of chip feature sizes, advanced packaging can effectively mitigate issues such as signal distortion, crosstalk, power consumption, and reliability in signal transmission. Faced with the development requirements of highly complex and heterogeneous integrated packaging structures, packaging companies face challenges in integrating more heterogeneous Chiplet chip systems without compromising yield and reliability. Therefore, simulation calculations based on Co-design are required in both front-end chip design and back-end chip packaging to provide solutions for device functionality realization.
Scope: The service covers simulations and designs for laminated boards, wire bonding, flip chip packaging, and system-level packaging, including fan-out packaging (FO), Chiplet integration and packaging, and advanced three-dimensional system-level packaging (SiP). It includes chip manufacturing processes such as deposition, etching, chemical-mechanical polishing, ball planting, and dicing models, as well as chip packaging processes and reliability simulations, such as substrate, bonding, thinning, filling, curing, and reliability verification models.
Reliability Service (Based on Self-developed CAPR Software)
Definition: The Xjiang Industrial software is a domestically developed CAPR software platform that integrates interface standards and data standard frameworks based on process and reliability.
Objective: Starting from the basic principles of thermal-electric-mechanical coupling, the service provides thermal analysis, force analysis, electromagnetic analysis, and their multi-scale and multi-physics coupling analysis.
Scope: The customized process covers chip manufacturing processes such as deposition, etching, chemical-mechanical polishing, ball planting, and dicing models. It also includes chip packaging processes and reliability verification, such as substrate, bonding, thinning, filling, and curing process models.
